NEETS MODULE 14 CHAPTER 1 MICROELECTRONICS
Q1. What problems were evident about military electronic systems during World War II?
Q2. What discovery opened the door to solid-state electronics?
Q3. What is microelectronics?
Q4. What discovery proved to be the foundation for the development of the vacuum tube?
Q5. Name the components which greatly increase the weight of vacuum-tube circuitry.
Q6. What are the disadvantages of point-to-point wiring?
Q7. What is a major advantage of modular construction?
Q8. When designing vacuum-tube circuits, what characteristics of tubes must be taken intoconsideration?
Q9. List the major advantages of printed circuit boards.
Q10. What is the major disadvantage of printed circuit boards?
Q11. The ability to place more components in a given space is an advantage of the _______.
Q12. Define integrated circuit.
Q13. What are the three major types of integrated circuits?
Q14. How do monolithic ICs differ from film ICs?
Q15. What is a hybrid IC?
Q16. How many logic gates could be contained in lsi?
Q17. What are the basic steps in manufacturing an IC?
Q18. Computer-aided layout is used to prepare _______ devices.
Q19. What purpose do masks serve?
Q20. What type of substrates are used for film and hybrid ICs?
Q21. Describe the preparation of a silicon substrate.
Q22. Name the two types of monolithic IC construction discussed
Q23. How do the two types of monolithic IC construction differ?
Q24. What is isolation?
Q25. What methods are used to deposit thin-film components on a substrate?
Q26. How are thick-film components produced?
Q27. What is a hybrid IC?
Q28. What is the primary advantage of hybrid circuits?
Q29. What is the purpose of the IC package?
Q30. What are the three most common types of packages?
Q31. What two methods of manufacture are being used to eliminate bonding wires?
Q32. On DIP and flat-pack ICs viewed from the top, pin 1 is located on which side of the referencemark?
Q33. DIP and flat-pack pins are numbered consecutively in what direction?
Q34. DIP and flat-pack pins are numbered consecutively in what direction?
Q35. Viewed from the bottom, TO-5 pins are counted in what direction?
Q36. The numbers and letters on ICs and schematics serve what purpose?
Q37. Standardized terms improve what action between individuals?
Q38. Microcircuit refers to any component containing what types of elements?
Q39. Components made up exclusively of discrete elements are classified as what type of electronics?
Q40. Resistors, capacitors, transistors, and the like, are what level of packaging?
Q41. Modules or submodules attached to a mother board are what packaging level?
Q42. What is the packaging level of a pcb?
Q43. What are the three most common methods of interconnections?
Q44. Name the three methods of interconnecting components in multilayer printed circuit boards.
Q45. What is one of the major disadvantages of multilayer printed circuit boards?
Q46. What was the earliest form of micromodule?
Q47. In what publication are environmental requirements for equipment defined?
Q48. In what publication would you find guidelines for performance of military electronic parts?
Q49. Who is responsible for meeting environmental and electrical requirements of a system?
Q50. What methods are used to prevent unwanted component interaction?
NEETS MODULE 14 CHAPTER 2 MINIATURE/MICROMINIATURE (2M) REPAIR PROGRAM AND HIGH-RELIABILITY SOLDERING
Q1. Training requirements for (2M) repair personnel were developed under guidelines established bywhat organization?
Q2. What agencies provide training, tools, equipment, and certification of the 2M system?
Q3. To perform microminiature component repair, a 2M technician must be currently certified inwhat area?
Q4. Multilayer printed circuit board repair is the responsibility of what 2M repair technician?
Q5. What are the three levels of maintenance?
Q6. Maintenance performed by the user activity is what maintenance level?
Q7. List the three groups of test equipment used for fault isolation in 2M repair.
Q8. What test equipment continuously monitors electronic systems?
Q9. NELAT and VAST are examples of what type of test equipment?
Q10. Stereoscopic-zoom microscopes and precision drill presses are normally associated with whattype of repair station?
Q11. Solder used in electronic repair is normally an alloy of what two elements?
Q12. In soldering, what alloy changes directly from a solid state to a liquid state?
Q13. Flux aids in soldering by removing what from surfaces to be soldered?
Q14. What type(s) of flux should never be used on electronic equipment?
NEETS MODULE 14 CHAPTER 3 MINIATURE AND MICROMINIATURE REPAIR PROCEDURES
Q1. What material is applied to electronic assemblies to prevent damage from corrosion, moisture,and stress?
Q2. What three methods are used to remove protective material?
Q3. What chemicals are used to remove protective material?
Q4. Abrasion, cutting, and peeling are examples of what type of protective material removal?
Q5. Why should the coating material be replaced once the required repair has been completed?
Q6. What term is used to identify the procedure of connecting one side of a circuit board with theother?
Q7. Name two types of through-hole termination
Q8. Turret, bifurcated, and hook terminals are used for what type of termination?
Q9. When a lead is soldered to a pad without passing through the board, it is known as what type of termination?
Q10. When does most printed circuit board damage occur?
Q11. What procedure involves the use of finely braided copper wire to remove solder?
Q12. What is the most effective method of solder removal?
Q13. When, if at all, should the heat-and-shake or the heat-and-pull methods of solder removal beused?
Q14. To what standards should a technician restore electronic assemblies?
Q15. How is oxide removed from pads and component leads?
Q16. Leads are formed approximately how many degrees from their major axis?

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Q17. When you replace components, identification marks must meet what requirements?
Q18. In what direction are component leads clinched on single- and double-sided boards?
Q19. What is solderability?
Q20. What is the most common source of heat in electronic soldering?
Q21. What determines the shape and size of a soldering iron tip?
Q22. What term describes a device used to conduct heat away from a component?
Q23. What is the appearance of a properly soldered joint?
Q24. When removing the component, under what circumstances may component leads be clipped?
Q25. How are imbedded TOs removed once the leads are free?
Q26. How is a flat pack removed from a pcb?
Q27. How do you prevent excessive heat buildup on an area of a board when soldering multileadcomponents?
Q28. What are the two final steps of any repair?
Q29. List three causes of damage to printed circuit boards.
Q30. What is the preferred method of repairing cracked runs on boards?
Q31. Damaged or missing termination pads are replaced using what procedure?
Q32. How is board damage caused by technicians?
Q33. What combination of materials is used to patch or build up damaged areas of boards?
Q34. List two causes of damage to ESD-sensitive electronic components.
Q35. What is the purpose of the wrist ground strap?
Q36. What is the cause of most accidents?
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